Describe the complete sequence of fabrication steps involved in the PolyMUMPs process, beginning with the bare silicon wafer and ending with the final released MEMS device. In your answer, be sure to include:
- The purpose and material of each layer deposited (including structural and sacrificial layers).
- The number and role of photolithographic masks used.
- The chemical and thermal processes applied at each major step (e.g., doping, LPCVD, annealing).
- The function and formation of key features such as dimples, anchors, and vias.
- The final release process and its significance in freeing the MEMS structures.
Bonus (5 points):
Explain why phosphorous doping is used for the polysilicon layers and how it affects the mechanical and electrical performance of the MEMS device.
Guidelines
Your assignment submission should be 100-250 words in length. The accepted formats are any standard digital formats such as word document, pdf, LaTex, spreadsheet, etc. When needed, you can submit codes such as MATLAB or Python.
It should contain proper grammar, be free of spelling errors, and reflect critical thinking. Make sure you have appropriate references.
Requirements: 250 words
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